BOJACK Solder Paste Flux No Clean Free Environmentally Friendly Soldering Flux Paste with 3 Brushes. Ideal for CPU Disassembly Assembly Special BGA PCB SMD Repair and Soldering(5.15oz/146g)

BOJACK Solder Paste Flux No an Free Environmentally Friendly Soldering Flux Paste with 3 Brushes. Ideal for CPU Disassembly Assembly Special BGA PCB SMD Repair and Soldering(5.15oz/146g)

BOJACK Solder Paste Flux No an Free Environmentally Friendly Soldering Flux Paste with 3 Brushes. Ideal for CPU Disassembly Assembly Special BGA PCB SMD Repair and Soldering(5.15oz/146g)

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BOJACK Solder Paste Flux No an Free Environmentally Friendly Soldering Flux Paste with 3 Brushes. Ideal for CPU Disassembly Assembly Special BGA PCB SMD Repair and Soldering(5.15oz/146g)

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BOJACK Solder Paste Flux No Clean Free Environmentally Friendly Soldering Flux Paste with 3 Brushes. Ideal for CPU Disassembly Assembly Special BGA PCB SMD Repair and Soldering(5.15oz/146g) - Details

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BOJACK Solder Paste Flux No Clean Free Environmentally Friendly Soldering Flux Paste with 3 Brushes. Ideal for CPU Disassembly Assembly Special BGA PCB SMD Repair and Soldering(5.15oz/146g) - Price Information

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BOJACK Solder Paste Flux No Clean Free Environmentally Friendly Soldering Flux Paste with 3 Brushes. Ideal for CPU Disassembly Assembly Special BGA PCB SMD Repair and Soldering(5.15oz/146g)

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[Properties] Milky white; Neutral pH 7±0.3; Gross weight 5.15oz/146g (large capacity); Melting point 60°C [Safe & Non-toxic] Contains natural rosin and synthetic resin, acid-free, lead-free, no cleaning and no irritating smell. [Efficient Performance] Precision electronic chip level soldering. The soldering flux paste is non-corrosive and oxygen-resistant for soldering iron with gold and copper alloy substrate, and does not damage the integrated circuits and PCBs, helping you realize mobile phone and PC boards without obstacles. [Easy to Use] Thin, wet and easy to use. This product is of high purity and is commonly used for welding. It has high strength at the joints, less residue, and does not agglomerate after emulsification and grinding with high-tech machines, which improves the fluidity and wettability of welding and helps your welding more stable and reliable. [Main Purpose] Meet the welding and special repair requirements of medium and high/BGA products; Suitable for circuit boards, sensors, cables, motors, electronic components, SMT repair and BGA chip ball placement, etc., Manufacturer: BOJACK
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