Gelid Solutions HeatPhase Ultra Intel Thermal Pad

Easier Application & Removal Designed for effortless application and removal, saving you time and effort during installation. The user-friendly design ensures a hassle-free experience for beginners. ULTRA THERMAL CONDUCTIVITY Experience unparalleled thermal conductivity that ensures fast and efficient heat dissipation. Our product is designed with state of the art technology to keep your devices cool even in the most intense conditions. ULTRA TOUGH & NON CURE For a long service life, our thermal interface is ultra tough and maintains its effectiveness over time. Unlike conventional options, it does not harden, which guarantees consistent performance without degradation even after long use. Non-electrically conductive: eliminates the risk of short circuits or electrical damage. It provides superior thermal management without compromising the integrity of your electronic devices.