Koch Chemie Micro cut pad polishing pad polishing sponge (diameter 126 mm).

☑️ High-quality special sponge for removing fine scratches, holograms and polishing marks using the Micro Cut M3.02 and Micro Cut & Finish P3.01 ☑️ The short height of 23mm creates low torsion forces, very good handling and the highest level of stability ☑️ The special density of the foam material enables long-lasting compression hardness during polishing ☑️ The optimized reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors ☑️ The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier, Weight: 45.0 grams, Manufacturer: Koch Chemie