Thermal Grizzly Minus Pad 8 8W/m K heat sink compound

The Thermal Grizzly Minus Pad 8 is the ideal choice for applications where thermal grease is not an option due to unwieldy application, or where there is a gap between the heat source and heat sinks, for example on memory chips and voltage transformers. It is based on a silicon-containing carrier complex and aluminum oxide as a heat transfer medium - as well as heat-conducting pastes, and it is also similarly efficient. The Minus Pad 8 is available in three different sizes - here 120 × 20 mm - as well as in five thicknesses between 0.5 and 3 millimeters, Whereby the pads work outstandingly even at very low contact pressure and the thermal conductivity is only slightly influenced by the thickness. The choice of the thickness should therefore only depend on the gap to be bridged. Technical details:- Dimensions 120x20x3mm- Quantity: 1- Thermal conductivity: 8 W / (m · K)- Operating temperature: -100 to +200 ° C