Xnrtop Aluminum Heat Sink Heatsink Module Cooler Fin for High Power Led Amplifier Transistor Semiconductor Devices with 100mm (L) x 69mm(W) x 36mm(H)

Xnrtop Aluminum Heat Sink Heatsink Module Cooler Fin for High Power Led Amplifier Transistor Semiconductor Devices with 100mm (L) x 69mm(W) x 36mm(H)

Xnrtop Aluminum Heat Sink Heatsink Module Cooler Fin for High Power Led Amplifier Transistor Semiconductor Devices with 100mm (L) x 69mm(W) x 36mm(H)

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Xnrtop Aluminum Heat Sink Heatsink Module Cooler Fin for High Power Led Amplifier Transistor Semiconductor Devices with 100mm (L) x 69mm(W) x 36mm(H)

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Xnrtop Aluminum Heat Sink Heatsink Module Cooler Fin for High Power Led Amplifier Transistor Semiconductor Devices with 100mm (L) x 69mm(W) x 36mm(H) - Details

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Xnrtop Aluminum Heat Sink Heatsink Module Cooler Fin for High Power Led Amplifier Transistor Semiconductor Devices with 100mm (L) x 69mm(W) x 36mm(H) - Price Information

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  • The price range for the product Xnrtop Aluminum Heat Sink Heatsink Module Cooler Fin for High Power Led Amplifier Transistor Semiconductor Devices with 100mm (L) x 69mm(W) x 36mm(H) is €£16.68to €£16.99 with a total of 2 offers.
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Xnrtop Aluminum Heat Sink Heatsink Module Cooler Fin for High Power Led Amplifier Transistor Semiconductor Devices with 100mm (L) x 69mm(W) x 36mm(H)

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Reduce the risk of hardware failure due to overheating Maximize surface area Designed in contact with the cooling air. The 23pcs fins increase the area of the board and thus provide for greater heat transfer Widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc. Please make sure that the size of the heat sink fits that of your component A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device, thereby allowing regulation of the device's temperature at optimal levels. In computers, heat sinks are used to cool central processing units or graphics processors. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as light emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to
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