Thermal Grizzly Minus Pad Extreme - 120 × 20 × 3 mm

The Thermal Grizzly Minus Pad Extreme is an excellent choice for applications where thermal paste is not an option due to its cumbersome application. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. This enables ideal surface design with maximum possible compaction. Thermal conductivity has been improved by approximately 260% over the Minus Pad 8, enabling the best performance for difficult cooling operations such as voltage regulators and memory ICs. The Minus Pad Extreme is available in different sizes and thicknesses - here 120 x 20 x 3 mm. The pads work excellently even with very low contact pressure, and the thermal conductivity is only slightly influenced by the thickness. The choice of thickness should therefore depend entirely on the gap to be bridged. The Minus Pad Extreme is electrically insul